AIN Ceramic Substrate

High Thermal Conductivity‌
Theoretical thermal conductivity reaches 320 W/(m·K), with practical production values achieving 200-260 W/(m·K), approximately 5-8 times higher than alumina ceramics.

‌Low Thermal Expansion Coefficient‌
Matches semiconductor materials such as silicon (Si) and gallium arsenide (GaAs) (4.0-6.0×10⁻⁶/℃), reducing risks of thermal stress failure.

‌Excellent Electrical Performance‌
Features high resistivity (>10¹⁴ Ω·cm), low dielectric constant (ε≈8.8), and low dielectric loss (tan δ <0.001), making it suitable for high-frequency circuits

‌Chemical Stability‌
Resists corrosion from molten metals (e.g., aluminum) and maintains stability under high-temperature oxidation (decomposition temperature >2450°C)
.